Trade-off Model of Fog-Cloud Computing for Space Information Networks

Document Type

Conference Proceeding

Publication Date

10-21-2020

Abstract

A steadily growing number of Internet-based service requests from the IoT has led to an increase in complexity and number of clients, resulting in an increased number of cybersecurity concerns. Although there are main security concerns with IoT services over cloud computing services, cloud computing is mostly preferred to provide seamless and scalable Intern-based services. Moreover, cloud service providers are continuously extending their capacity to reach more industries and address their concerns. For example, Amazon has recently launched a pay-as-you-go cloud computing service that will take place on satellite operators to provide more IoT services to industries such as the agricultural and shipping industries. However, the secure transfer of information within a space information network is of great concern due to the ability of numerous attacks between nodes to occur. This can be followed by loss of data Confidentiality, Integrity, and Availability. Several researchers have proposed multifaceted solutions to these concerns, including blockchain application, digital signature, and symmetric/asymmetric encryption schemes, and centralized and/or decentralized key management for space information networks. In this paper, we focus on the integration of fog-cloud computing and space information network. We primarily investigate the feasibility of fogcloud architecture in space information networks and the benefits of having fog computing in the security of space information networks. This is accomplished mainly by reviewing existing works on fog-cloud computing and space information networks, as well as evaluating both proposed solutions to potential issues regarding security.

Publication Title

IEEE Cloud Summit 2020

Start Page No.

91

End Page No.

96

ISSN

978-1-7281-8266-7

DOI

10.1109/IEEECloudSummit48914.2020.00020

Comments

Due to copyright restrictions, this item will only be available through IEEE.

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